PODCAST

3D IC

Siemens Digital Industries Software

Three-dimensional integrated circuits take less space and deliver higher performance.

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3D IC Front-End Architecture
Mar 23 2022
3D IC Front-End Architecture
For 3D IC to achieve its full potential there is a need to utilize cost-effective front-end design approaches. This is because different microarchitectures will result in different physical sizes, power performance, and cost of production. One of the solutions that have been successfully deployed is the high-level predictive analysis which helps in figuring out optimal architectures for specific cases.In this episode, John McMillan interviews Anthony Mastroianni, the 3D IC Solutions Architect Director at Siemens Digital Industries Software. And, Gordon Allan, Product Manager for Verification IP Solutions at Siemens EDA. They’ll help us understand 3D IC front-end aspects and the latest developments in this field.In this episode, you’ll learn how predictive analytics can be utilized to make 3D IC design faster and cheaper. You’ll also learn what 3D IC front-end design involves and the best way of approaching it. Additionally, you’ll hear about what Siemens is doing to contribute towards making the design process more efficient.What You Will Learn in this Episode:The role of predictive analytics in the front-end design of 3D IC (03:03)How 3D IC packaging should be approached (08:35)The design aspects enabled by 3D IC (12:06)What Siemens is doing to help in front-end 3D IC design (14:50)Connect with Gordon Allan: LinkedInConnect with Anthony Mastroianni: LinkedInConnect with John McMillan: LinkedIn See acast.com/privacy for privacy and opt-out information.
3D IC Package Design Flows
Mar 9 2022
3D IC Package Design Flows
In most cases, it’s very expensive to get game-changing technological advancements in electrical components to the market. This is because they also require the advancement of the existing design workflows and tools. This barrier has slowed down and even completely stopped the possible mass production of many revolutionary devices. 3D IC is not exempt from this challenge - that’s why several large companies have invested heavily in the development of new package design flows and tools to handle it.In this episode, John McMillan interviews Anthony Mastroianni, the 3D IC Solutions Architect Director at Siemens Digital Industries Software. He has been in the semiconductor industry for over 30 years, primarily in the design of custom integrated circuits. He will help us understand the necessary design flow changes needed to make 3D IC  a reality.In this episode, you will learn about the differences between traditional semiconductor packaging and 3D IC packaging. You will also hear about the design workflow required to successfully build 3D IC-based devices. Additionally, you will hear about the new tools that are required to successfully create and test such devices.What You Will Learn in this Episode:The difference between 3D IC and traditional semiconductor packaging (01:37)Why 3D IC requires a change in package design flows (03:28)The workflows envisioned for 3D IC (05:57)The new tools required to handle the new workflows (07:47)The most critical 3D IC workflows (11:13)Connect with Anthony Mastroianni: LinkedInConnect with John McMillan: LinkedIn See acast.com/privacy for privacy and opt-out information.
The Application and Adoption of 3D IC
Feb 16 2022
The Application and Adoption of 3D IC
Standardization plays an important role in promoting the mass adoption of new electrical components. For instance, Application-Specific Standard products, known as ASSP components have been broadly adopted by system designers for board-level integration. These devices have standardized models to enable the PCB level, system design ecosystem. Chiplets are an analogous component that can be integrated at the package level. That’s why the 3D IC design community will likely advocate for standardized models to be adopted by prospective chiplet vendors.In this episode, John McMillan interviews Anthony Mastroianni, the 3D IC Solutions Architect Director at Siemens Digital Industries Software. He is also a member of the Chiplet Design Exchange, whose charter is to standardize chiplet models and deliverables. He will help us understand the application of 3D IC and the need for standard chiplet models.In this episode, you will find out how the 3D IC technology is being utilized and the impact it is having. We will also discuss what the future holds for this new methodology and the steps that need to be made to drive its adoption. Lastly, you will learn about the progress being made in standardizing chiplet models and the need for defined workflows to facilitate a chiplet ecosystem.What You’ll Learn in this Episode:Types of applications and packaging technologies currently deploying 3D IC methodologies (01:37)Where the industry is heading in terms of 3D IC adoption (05:08)The types of chiplets available today (05:51)The role of Chiplet Design Exchange in driving 3D IC adoption (07:37)Connect with Anthony Mastroianni: LinkedInConnect with John McMillan: LinkedIn See acast.com/privacy for privacy and opt-out information.